Thermal Grizzly Minus Pad Basic – 120 x 20 x 1,0 mm, 4 vnt

Powerful Alternative to Thermal Paste

With the Thermal Grizzly Minus Pad Basic, the Hamburg cooling specialist expands its product range with advanced thermal pads. Based on the predecessor Minus Pad 8, they have been further developed to significantly improve thermal conductivity.

The Minus Pad Basic is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heatsink needs to be bridged. It is therefore perfectly suited for use with memory chips or voltage converters. It is based on a silicone-containing carrier complex and aluminium oxide as the heat transfer medium, achieving a similar thermal conductivity to thermal paste.

The Minus Pad is available in various dimensions and thicknesses from 0.5 to 3 millimetres. Since it works optimally with minimal contact pressure and the thermal conductivity is hardly influenced by the thickness, the choice of thickness should only be tailored to the distance to be bridged.