Thermal Grizzly Minus Pad Basic – 120 x 20 x 0,5 mm, 4 vnt

High-Performance Alternative to Thermal Paste

With the Thermal Grizzly Minus Pad Basic, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Based on the predecessor Minus Pad 8, they have been further developed to significantly improve thermal conductivity.

The Minus Pad Basic is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heatsink needs to be bridged. It is therefore perfectly suited for use in memory chips or voltage converters. It is based on a silicone-containing carrier complex and aluminium oxide as the heat transfer medium, achieving similar thermal conductivity to thermal paste.

The Minus Pad is available in various dimensions and thicknesses ranging from 0.5 to 3 millimetres. Since it works optimally even with minimal contact pressure and the thermal conductivity is hardly affected by thickness, the choice of thickness should only be matched to the distance that needs to be bridged.