Thermal Grizzly Minus Pad Advance – 120 x 20 x 0,5 mm, 4 vnt

High-Performance Alternative to Thermal Paste

With the Thermal Grizzly Minus Pad Advance, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Based on its predecessor Minus Pad 8, they have been further developed to significantly improve thermal conductivity.

The Minus Pad Advance is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heat sink needs to be bridged. It is therefore perfectly suited for use with memory chips or voltage converters. It is based on a silicone-containing carrier complex and aluminium oxide as the heat transfer medium, achieving a thermal conductivity similar to that of thermal paste.

The Minus Pad is available in various sizes and thicknesses from 0.5 to 3 millimetres. As it works optimally even with minimal contact pressure and its thermal conductivity is hardly influenced by thickness, the choice of thickness should only be tailored to the distance that needs to be bridged.