Thermal Grizzly Minus Pad Advance – 100 x 100 x 0,5 mm, 2 vnt

Powerful Alternative to Thermal Paste

With the Thermal Grizzly Minus Pad Advance, the Hamburg cooling specialist expands its product range with advanced thermal pads. Based on its predecessor, the Minus Pad 8, they have been further developed to significantly improve thermal conductivity.

The Minus Pad Advance is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heatsink needs to be bridged. It is therefore optimal for use with memory chips or voltage converters. It is based on a silicone-containing carrier complex and aluminium oxide as a heat transfer medium, achieving similar thermal conductivity to thermal paste.

The Minus Pad is available in various sizes and thicknesses ranging from 0.5 to 3 millimetres. Since it works optimally even with minimal pressure, and its thermal conductivity is hardly affected by thickness, the choice of thickness should only be based on the distance that needs to be bridged.