Akasa AK-CC6609EP01 Low Profile procesoriaus aušintuvas – Sockel LGA 1700, 21,8 mm Höhe

• Height of the heatsink is only 21.82mm
• Embedded PWM fan with long life Enter bearing
• Intelligent PWM and silent fan
• Good airflow

Ultra low-profile 21.8mm heatsink with embedded fan provides low-noise compact cooling solution for Intel® LGA1700 processors up to 35W TDP in thin mini-ITX and SFF chassis.

Extra Large Core Shape, More Cooling Performance
The new LGA1700 socket caters for processors with larger package sizes compared to previous desktop processor generations. To ensure maximum contact and thermal transfer, Akasa has increased the contact area between the cooler core and the processor in order to maximise heat dissipation and cooling performance.

Low-Profile and Compact
Maximum heatsink height of 21.82mm which makes it perfect for low profile systems and Small Form Factor (SFF) such as Thin-Mini-ITX, Cube and HTPC cases.

Intelligent and Optimised Design
Hi-performance aluminium heatsink with an embedded 75mm fan that features intelligent PWM function, delivers as much air as needed at any given time to cool the CPU. Coupled with hi-grade thermal interface pre-applied. Ensuring that the cooler delivers outstanding cooling performance.

New and Easy Mounting Design
Perfect for the new Intel LGA1700 socket mounting pattern with extra-safe metal screws and retention plate.

Array of Compatibility
Supports common desktop motherboards such as ATX, Micro-ATX, and Mini-ITX.